3M brings precision, efficiency and performance to your manufacturing process.
If you are involved in semiconductor production and handling, you should be partnering with 3M. Our expertise in areas like microreplication, nanotechnology and molding provide solutions which help enable the uniformity and precision your processes demand.
For more than 50 years, 3M has been providing a wide range of materials to get you from start to finish in your process. That includes everything from CMP and surface finishing materials for wafer processing to fluids for thermal management to tape and reel for chip transport.
And when you partner with 3M, you have global support. Our technicians are there to help in key locations around the world.
Enabling faster, easier, more reliable ways to build tomorrow's semiconductors. 3M Wafer Support System (WSS) is proven in high‐volume manufacturing for temporary wafer bonding during wafer thinning and additional TSV processes.
High performance chemicals for heat transfer, cleaning and surface tension reduction to increase throughput, performance and reliability while helping keep costs under control.
3M Pad Conditioners for CMP provide consistent performance for current and advanced technology node chemical mechanical planarization processes. Pad conditioners are available in multiple sizes and configurations to fit most new and legacy CMP tools.
Frequent and thorough cleaning of equipment and tools used in semiconductor manufacturing is critical in order to help remove particulates and other contaminants that can lead to device failure.
Unfortunately, some conventional solvents, such as IPA and acetone, are flammable and can be damaging to certain delicate materials. And non-flammable options, such as aqueous cleaning processes, can leave residue and increase risk of corrosion. They may also require higher capital equipment and operating costs.
That’s why 3M offers non-flammable, advanced cleaning solvents to help address your performance, safety and environmental needs.